For both EPIG and ENEPIG processes, the solder joint reliability as determined by a high speed shear test was examined, with the deposits as-plated and after heat treatment.
For the M705 solder, the break energy following heat treatment with EPIG decreased compared to as-plated, while the break energies remained similar for ENEPIG.
The results show that the choice of proper solder when using EPIG is necessary for optimum performance.
When the gold and palladium thickness was decreased, the EPIG film had less WBR after heat treatment because copper diffused onto the gold, and the ratio of palladium in the gold layer was higher.
EPIG deposits with thicker palladium had good WBR because the palladium layer prevented copper diffusion to the top of the gold surface after heat treatment.
Although many of the gene expression alterations identified by EPIG confirmed those that were previously published, the real strength of this analysis is the identification of those genes and processes that may be related to events other than methapyrilene-mediated hepatotoxicity.
We used the analytical program EPIG to identify significant changes in gene expression on the basis of their pattern of expression over time, including both doses and the two tissues.
The results provided by EPIG analysis of the gene expression patterns confirms the gene changes identified in the previously published reports (Hamadeh et al.
EPIG identified three profiles that are indicative of an acute response to methapyrilene administration, that is, either induction or repression after a single dose of methapyrilene only.
EPIG extracted nine patterns of change in gene expression and identified a total of 1,811 genes as significantly altered in response to IR (Figure 3).
We performed a similar analysis using 1,811 genes that were selected by EPIG as showing significant response to IR-induced DNA damage.
EASE analysis of all genes selected by EPIG based on the Gene Ontology biological process.