FBGAFine Line Bga
FBGAFine Pitch Bga
FBGAFine-Pitch Ball Grid Array
FBGAFlorida Blueberry Growers Association
FBGAFort Benning, Georgia
FBGAFlex Ball Grid Array (tape substrate)
FBGAFlorida Bass Guide Association (fishing)
FBGAFredericton Botanic Garden Association (Canada)
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References in periodicals archive ?
This paper focuses on the life prediction of BGA and FBGA (Sn-3.0Ag-0.5Cu (wt.%)) packages.
The interrogation unit is a custom-developed instrument built around a commercial fiber Bragg grating analyzer (FBGA) from Bayspec Inc., that implements the schematic of Figure 2(a) by commercial optoelectronic components integrated with a microcontroller.
PdCu ball bonds shows better and larger cycles to failure compared to Au ball bonds on 110 nm device FBGA 64 package.
Pin-compatible with the MSM3100, the MSM3300 will be available in the same 208-ball Fine-Pitch Ball Grid Array (FBGA) production package.
MCPs include a broad range of vertically stacked packages, including TSOP, FBGA, QFN and WLP, as well as complex system-in-package devices, multichip modules (MCM), package-in-package (PiP) and package-on-package (PoP).
* A design to interface with 0.5 mm pitch Fine pitch Ball Grid Array (FBGA) packages.
The example furnished in Figure 3 illustrates a straightforward vertical integration of four FBGA packaged memory devices joined together using pre-formed spherical tin-silver alloy contacts.
It is also reported that in order to maintain greater stability and signal integrity at higher clock speeds, all aXeRam modules are said to incorporate 128Mx8 high-quality DDR3 FBGA chips.
Sample Shipment: MB86H01 Series Product Package Sample Availability MB86H57 FBGA 650 pin From end of July 2009 MB86H58 PBGA 496 pin From end of July 2009
Actel offers support of all device packages including, but not limited to PLCC, PQFP, VQFP, QFN, BGA, FBGA and CSP.
The new devices are manufactured using Elpida's 0.10-micron process technology and are available in 104-pin FBGA packages.
Other features include 1.8V operation to enable power management in dense circuit board designs and a 165-pin, 13mm x 15mm FBGA package.