FC-BGAFlip-Chip Ball Grid Array
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to expand existing investments in the manufacture of Flip Chip Ball Grid Array (FC-BGA) products, as well as capacity to cater to new drivers of growth such as artificial intelligence and establishment of data centers.
SPIL described packages for 5G and also discussed some of the extremely large flip-chip ball grid array (FC-BGA) packages for high-performance applications, describing 65 x 65mm and 75 x 75mm FC-BGAs.
Abstract: This paper presents the complete through-hole filling for cores using a Cu electroplating process for IC package production, especially for FC-BGA and FC-CSP.