with DC were laid out on the test vehicle (TV) (1), and two [mu]PGA sockets were laid out on another TV (2) to trace the reliability of the package and solder joint.
The VSC3172-12 is available today, packaged in a 33-sq-mm, 613-pin, lead-free FCBGA
Apodis ASSPs are offered in 31x31mm 896 pin FCBGA
Samples of Renesas' R-Car H1 SoC will be available starting in November 2011, equipped in an 832-pin FCBGA
(flip-chip ball-grid array) package.
The IDT Tsi721 is currently sampling to qualified customers and is available in a 13x13mm FCBGA
The device is implemented in 40nm CMOS technology and packaged in a 480-pin 23mm x 23mm FCBGA
The IDT CPS-1432 is currently sampling to qualified customers and is available in a 25x25 mm FCBGA
is an organic-buildup, surface-laminar circuit (SLC) substrate to which an integrated circuit (IC) chip is attached as a die bump to the flip-chip pad solder connection.
The IDT VPS-1616 and SPS-1616 are available in a 21x21mm FCBGA
package and are priced at $59 and $84 in volume, respectively.
The VSC3340-31 is available now in a 23mm x 23mm, 484-pin FCBGA
The IDT CPS-1848 switch is available in a 29x29mm FCBGA
package and is priced at $99 in volume.
The package is a 576-pin FCBGA
(flip chip BGA) measuring 27 mm x 27 mm.