FCCSPFlip Chip Csp
FCCSPFlip-Chip Chip Scale Package
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References in periodicals archive ?
Institutional investors pointed out that Samsung Electronics, Apple's contract manufacturer of A5 processors, has asked Kinsus to speed up delivery of FCCSP substrates since September in response to the upcoming new iPhone and iPad.
Fueled by strong shipment of FCCSP substrates, the Taiwanese company is expected to see its sales revenue hit a single-month high of NT$1.55 billion in September, finishing the third quarter of this year with combined revenue of NT$4.6 billion, representing a 12-13% increase from a quarter earlier.
In addition to increasing shipment to Samsung Electronics, the robust growth momentum seen in the third quarter is also enhanced by rush orders for FCCSP substrates, SiP (system in package) substrates and PBGA (plastic ball grid array) packaged substrates from its large-sized customers, including Qualcomm, Broadcom and Taxes Instruments.