FOWLPFan-Out Wafer Level Package
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"FOWLP is being used to make chips for mobile phones, and much of the electronics used in automobiles and aerospace applications will soon be packaged in this way," says Gotro.
In 2016, TSMC's fan out wafer-level package (FOWLP) for the A10 application IC for Apple will have some impact on flip-chip CSPs, which will make the substrate business uncertain.
To reach the goal of <0.8mm, some companies are expected to use an FOWLP for the logic device in the bottom PoP.