FPBGAFine Pitch Ball Grid Array
FPBGAFine-Pitch Ball Grid Array
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The MC432 is packaged in a 672 FPBGA (FlipChip Plastic Ball Grid Array) and is expected to sample in quantity in the fourth quarter of 2005.
The products are available now and they are packaged in a 19 mm FPBGA. Pricing begins at $139 per unit in OEM volumes of 10,000.
Typical software packages have standard BGA, FPBGA and CSP inspection libraries that allow the user to self-teach a system to recognize the component layout, the proper solder diameter and grey level directly during the initial process without set-up time.
This system can perform an automated evaluation of a standard FPBGA 255, including four to six views, in only one to two minutes.
The CX81400 is fabricated using a state-of-the-art 0.18-micron CMOS process and it is enclosed in a 160- or 100-pin FPBGA package.
There has also been significant expansion in capacity for newer FPBGA, CSP, SIP, WLP and flip chip-based packaging (FIGURE 1).