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References in periodicals archive ?
Flip Chip Technologies, a joint venture of Kulicke & Soffa Industries and Delphi Delco Electronics Systems, based in Phoenix, Arizona, is an innovative, high-volume wafer bumping resource providing IC packaging services and expertise to the semiconductor industry.
Face-down wired flip chip technologies are covered along with an area array tape-automated bonding type of flip chip.
This book is particularly aimed at individuals active in research and development of flip chip technologies, and is useful to those engineers who have encountered problems with the technology or must choose a high performance, robust and cost-effective packaging technique for their product.
"We are delighted with the licensing agreement with California Micro Devices which demonstrates our mutual commitment to excellence and advancement of the semiconductor packaging industry," stated Harry Hollack, president and CEO of Flip Chip Technologies. "Our ongoing partnership and today's agreement responds to our customer, whose voice provided the impetus that grows the popularity and value of chip scale packaging in today's electronic systems.
"This agreement represents the natural next step in the partnership formed with Flip Chip Technologies over a year ago," stated Jeff Kalb, president and CEO of California Micro Devices.