HDPUGHigh Density Packaging Users Group
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It is likely, HDPUG says, that end-users will demand data from their supply chain that indicate the impact of each system/product type that they procure.
It is clear, however, HDPUG says, that decisions made at the design stage of a product can have a major impact on the environmental footprint of a printed circuit assembly.
The IPC/JEDEC J-STD-709, currently titled, Limits for Bromine and Chlorine in Flame Retardants and Polyvinyl Chloride in "Low Halogen" Electronic Products, is a document developed by a consortium of companies who paid to initiate a project through HDPUG. This document was later brought to the IPC for consideration as a standard.
Additional testing on the NEMI alloy by the High Density Packaging User Group (HDPUG) showed the same results.
There are quite a few programs including individual OEM driven programs, IPC task groups, HDPUG initiatives and iNEMI projects.
Two of the components tested by NEMI--the 208CSP and 256PBGA--have also been investigated by lead-free projects conducted by the High Density Packaging User Group (HDPUG) and the National Center For Manufacturing Sciences (NCMS).
John Stankus, of Nortel Networks (Brampton, Ontario, Canada), detailed materials issues and the activities of the High Density Packaging User Group (HDPUG) to develop a standardized materials properties database.
The High Density Packaging User Group (HDPUG, Scottsdale, AZ) has announced the formation of the Global Environmental Coordination Initiative (GECI, Scottsdale, AZ), which will work across the electronics industry and around the globe to facilitate introduction of lead-free solder into electronics manufacturing.