HASL

(redirected from Hot Air Solder Leveling)
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AcronymDefinition
HASLHealth and Safety Laboratory
HASLHot Air Solder Leveling
HASLHawaii Association of School Librarians (Honolulu, HI)
HASLHuntsville Adult Soccer League (Huntsville, AL)
HASLHandicap Awareness and Support League (Grants Pass, Oregon)
HASLHistorical Advanced Squad Leader (gaming)
HASLHeart of America Softball League (Gladstone, MO)
HASLHeight Above Mean Sea Level
HASLHarpoon Augmented Spares List (US DoD)
HASLHigh Availability Systems Laboratory
HASLHigh Assurance Software Laboratory
HASLHamilton Art Student League (Clinton, NY)
HASLHeating Appliances and Spares Ltd (UK)
References in periodicals archive ?
If you are using or considering organic solder protectant (OSP) coated substrates instead of hot air solder leveling (HASL), this test is extremely important.
Low-solids fluxes do not need to be removed, but the bare board and components must be clean and not contain surface residues that are corrosive or conductive, such as hot air solder leveling (HASL) flux and plating bath residues.
The development of hot air solder leveling (HASL) in the early 1980s necessitated technical improvements in peelable technology that enabled these systems to withstand the new demands of the HASL process.
ENTEK(r) PLUS Gold copper protective coating is used as an alternative to hot air solder leveling (HASL) and other PWB surface finishes and is specifically formulated for mixed metal surfaces.
The mixed technology assembly process on Umpire boards, finished via hot air solder leveling (HASL), used a low residue solder paste (probeable), a low residue liquid flux (alcohol-based) and a low solids core solder (with additional liquid flux followed by alcohol and brush localized cleaning).
The mixed-technology assembly process on Umpire boards, finished via hot air solder leveling (HASL), used a low residue solder paste (probeable), a low residue liquid flux (alcohol-based) and a low solids core solder (with additional liquid flux followed by alcohol and brush localized cleaning).
My evaluation used IPC B24 boards-FR-4 boards with copper traces on one side with a hot air solder leveling (HASL) surface finish.