Release date- 07082019 - Concord, California - Nordson MARCH, a division of Nordson (NASDAQ: NDSN), a global leader in plasma processing technology, will present the paper, 'Plasma Applications for Wafer Level Packaging, Part 1,' at the 20th annual International Conference on Electronic Packaging Technology (ICEPT
) in Hong Kong 11-15 August 2019.
Dependent Maternal mortality Maternal mortality variables intercept ratio of change Independent (b) (B) (b) (B) variables ICEPT1 SLOPE1 Female literacy -7.648 * -0.854 * -2.31 * -0.540 * levels (ICEPT
) Female rate of -4.92 * -0.232 * change (SLOPE) Age at marriage 0.052 0.007 -4.55 -0.090 * P < 0.05; b and B are unstandardized and standardized regression coefficients.
Professor Pearson joins LCRI from Imperial College, where he was director of the Centre for Energy Policy & Technology (ICEPT
Nishikawa, "Coarsening of Bi phase and intermetallic layer thickness in Sn-58Bi-X (X=In and Ni) solder joint," in Proceedings of the 14th International Conference on Electronic Packaging Technology (ICEPT
Wen, "Drop performance research of silver content on the SnAgCu based lead-free solder of joint level," in Proceedings of the 201314th International Conference on Electronic Packaging Technology, ICEPT