References in periodicals archive ?
Wesby, "A Characterization Study of Direct Imaging Technique for Stencil Printing of Thick boards (0.125") in the Alternative Assembly and Reflow Technology (AART) or Pin-in-Paste Process," IEMT - Board Level Assembly, Semicon Southwest, 1998.
Maximizing mixed-technology applications: how pin-in-paste cuts wave soldering time and costs
Haseeb, "Effects of stacking sequence of electrodeposited Sn and Bi layers on reflowed Sn-Bi solder alloys," in Proceedings of the 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT '12), 6,1 pages, Perak, Malaysia, November 2012.
Properties and Microstructures of Sn-Bi-X Lead-Free Solders
The challenges in assembly with the introduction of copper low-k silicon were described by LSI Logic during the IEMT symposium.
Front-end and back-end boundary blurs: SemiCon West shows an increasing number of devices packaged at the wafer level
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