Simulating large format InSb IRFPAs in three dimensions is very time and memory consuming.
InSb IRFPAs detector is composed of InSb chip, indium bumps array, Si ROIC substrate, and underfill material.
8x8 InSb IRFPAs. To learn the effects from indium bump sizes to von Mises stress and its distribution in InSb chip, a small format array of 8 x 8 elements InSb IRFPAs model is selected, and the simulation results are given in Figure 3.
64 x 64 InSb IRFPAs. For obtaining the von Mises stress and its distribution in 64 x 64 InSb IRFPAs in short time period, a typical structure with indium bump diameter of 24 [micro]m and height of 21 [micro]m is selected.
"Third generation and multi-color IRFPA
developments: a unique approach based on DEFIR", in Proc.SPIE, Infrared Technology and Applications, XXXI: 5783: 350-365.
Laser source with optical setup Figure (1) for laser sheet formation and IRFPA experimental seeker assembly in figure (2) and internal scanning mechanism in third generation advanced anti-tank guided missiles (ATGM).
2nd to 4th generation Seekers Electro- Optics and IRFPA Assembly Third and fourth generation IRFPA seeker used LASER Striking Countermeasure (LSCM).
High speed changes in speckle pattern images are observed from IRFPA. Results are yet to be analyzed in near future.
These postage stamp sized arrays contain tens of thousands of IR detector elements called "pixels." When an IR scene is focussed on the IRFPA, the scene information on each pixel can be rapidly read out to a signal processor, where the IR scene can be inspected to detect and track targets such as enemy tanks or missiles.
Since it is a staring device, the IRFPA actually "sees" or creates an image of the scene much like a television.
After a stormy beginning, during which the fate of the IRFPA initiative was debated by Congress, the program was finally started in 1989 with limited funding under the direction of DARPA.