Researchers at Fraunhofer IZM
, in cooperation with Suss MicroTec, introduced an excimer laser dual damascene process for ultra-fine line multilayers with 10pm micro-vias for wafer and panel-level packaging.
project manager Erik Simon can envision a whole swathe of potential applications, particularly where there is a need to provide protection over a large surface area.
It indicates that the air velocity predicted by the IZM
was slightly stronger than that of the k-[epsilon] CFD model.
and the Technical University of Berlin discussed inline monitoring of epoxy molding compound in transfer molding for smart power modules.
That's why the infrared LED emits light waves that are scattered back in fog but not in conditions of darkness," explains IZM
group manager Dr.
Professor Karlheinz Bock, head of Polytronic Systems at German research institute Fraunhofer IZM
, which is taking part in the EU project, said the device "shows clearly the possibilities for polytronics".
Zhao of Analog Devices and Lars Boettcher of Fraunhofer IZM
Berlin took home best paper honors for the SMTA International conference in September 2005.
recently installed Asymtek's Axiom[TM] X-1020 high volume dispensing system in its Center for Applied Research, which focuses on interconnection technologies and microelectronics.
Following a review of 29 exemptions, Oko Institute and Fraunhofer IZM
have recommended seven not be continued: lead in linear incandescent lamps (Exemption 16); lead as activator in the fluorescent power of discharge lamps (Exemption 18); lead with PbBiSn-Hg and PbBiSn-Hg in specific compositions (Exemption 19); lead in oxide glass used for bonding front and rear substrates of flat fluorescent lamps used for LCDs (Exemption 20); lead oxide in the glass envelope of black light blue; lead alloys as solder for tranducers used in high-powered loudspeakers (Exemption 27); and hexavalent chromium in corrosion preventive coatings (Exemption 28).
Invited speakers from companies such as Panasonic, IBM and Fraunhofer IZM
will discuss the optimization of integrated process solutions in respect to performance and cost.
3] Technologies based on: Ridge Formation with Clad Backfill Technology-- Screen print Embossed General or mold Attribute Representative Gemfire / OptoFoil- practitioners Dow Corning Fraunhofer Institute, IZM
General Hot Embossing of process commercial description available polymer foil using special negative tool made by high quality lithography and galvanic metallization.
Research institutes and consortia developing these methods include the Fraunhofer IZM
in Berlin and Munich, IME in Singapore, IMEC in Belgium, Lincoln Labs and MCNC-RDI in the U.