LFCSPLead Frame Chip Scale Package
LFCSPLead Frame Chip Scale Packaging (analog devices)
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LF-CSP technology is the simplified technique of PT-CSP systems, and its thermal conversion efficiency is less than that of other two CSP technologies; meaning that the LF systems need a relatively higher cost to increase the thermodynamic efficiency of LFCSP systems.
The new products offer the following features: high relative accuracy ([+ or -]2LSB max at 16-bits); on-chip 2.5V, 2ppm/[degree sign]C integrated reference and low drift; 3mm x 3mm, chip-scale 16-pin LFCSP package; 4kV HBM ESD rating; as well as choice of resolution (16, 14 or 12 bits) and interface (SPI or I2C).
The ADP5034 and ADP5024 are fully specified over the junction temperature range of -40 degC to 125 degCand both are available in a 24-lead, 4 mm x 4 mm LFCSP packages.
The amplifiers are also offered in the standard SOT-89 package, as well as in smaller and more compact LFCSP packaging, to promote board area savings.
The AD8663 is available in 8-lead LFCSP and SOIC; the AD8667 is available in 8-lead MSOP and SOIC; and the AD8669 is available in 14-lead SOIC and TSSOP.
Analog Devices introduced its ADP5034 regulator/LDO, an integrated power management IC that combines two 3-MHz, high efficiency, 1.2-A step down regulators with two 300-mA LDO (low drop out) regulators in a small LFCSP (lead-frame chip-scale) package.
The ADG1411 is available in 4 mm X 4 mm LFCSP packages as well as TSSOP packages.
It will be priced at USD1.45 per unit in quantities of 1,000 and is packaged in a 3 mm x 3 mm LFCSP (lead-frame chip-scale package).