This held true for the VOC OAWS and low-solid VOC LRNC fluxes.
High activity fluxes (OAWS and LRNC) offered ~10% better barrel fill than VOC-free no-clean fluxes on the 0.125"-thick OSP boards.
For the low VOC LRNC flux, lower board temperature resulted in lower solder bridging for Flux D.
For the low VOC LRNC flux, higher conveyor speed resulted in less solder bridging for Flux D.
On average, OAWS VOC fluxes exhibited less bridging than LRNC low VOC fluxes.
LRNC low residue Flux E had an uncharacteristically high rate of bridging with the combination of low conveyor speed and high preheat temperature.
Higher preheat increased solder skips when using a VOC-free OANC flux, while lowering the incidence of skips with low VOC LRNC and VOC OAWS fluxes.
When using low-residue LRNC flux, there appeared to be fewer solder balls at higher conveyor speed.