Therefore, the effect of the plasma treatment on the ILD must be taken into consideration because the dielectric constant of the low-k dielectric is the most essential factor in determining the RC delay time of the interconnects.
[H.sub.2] plasma treatment yields an excellent removal rate of the Cu oxide layer and has less impact on the formation of Cu hillocks and the low-k dielectric layer in comparison to N[H.sub.3] plasma treatment.
With this recent order, GaSonics' involvement will be extended to encompass the characterization of new low-k dielectric materials, such as FLARE(TM), HOSP(TM) and Nanoglass(TM).
The basis for the work is GaSonics' proprietary system using a downstream microwave plasma to remove photoresist material without damaging low-k dielectric material on the wafer surface.
Zhao et al., "Influence of porosity on electrical properties of low-k dielectrics," Microelectronic Engineering, vol.
King, "Ultraviolet radiation effects on paramagnetic defects in low-k dielectrics for ultralarge scale integrated circuit interconnects," Applied Physics Letters, vol.
Materials, technology and reliability of low-k dielectrics
and copper interconnects; proceedings.
Materials and equipment suppliers also are leveraging the NIST-provided measurements to engineer novel nanoporous films with even more complex microstructures, broadening the search for economical, high-performance low-k dielectric
CMOS 9S also uses another IBM chip-making breakthrough -- "low-k dielectric
" insulation -- to meticulously shield millions of individual copper circuits on a chip, reducing electrical interference between wires that can hinder chip performance and waste power.
IBM said the low-k dielectric
helps the company solve signal interference problems.
It is one of the few XRF analyzers to work with advanced low-k dielectrics
. The RQ Jade features flexible manual wafer loading, and a simple cassette interface.
Some of the challenges are materials related, such as transistors with high-k dielectrics and on-chip interconnects made from copper and low-k dielectrics
. The magnitude of these challenges demands special attention from those in the metrology and analytical measurements community.