MCM-DMulti-Chip Module Deposition
MCM-DDeposited Multi-Chip Module
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The new maskless laser direct imaging tool will be used to expose MCM-D circuit and dielectric layers without photomasks.
Rusty Pearson, president of Etec Polyscan, stated: "These contracts will allow us to extend the range of solutions that Etec Polyscan can offer to the MCM-D and flat panel display industries.
ELMO's in-house microelectronic technologies include: Known-Good-Die (KGD), 3-D Die Stacking, Chip Scale packaging, advanced MCM-L (Laminate), MCM-C (Ceramic), MCM-D (Deposited), Chip-on-Board (COB) and high performance Power MCM's.