This has applications in life sciences, micro-optics, micro technology and nano-technology, as well as semi-conductor production and micro-electromechanical or electro-optical systems (MEMS and
MEOMS).
Technical coverage includes such topics as design for manufacturability (DFM); test and reliability (DFX); system in package (SiP), MCMs and 3-D packaging; integrated manufacturing and test; RF/microwave and high clock rate systems/sub-systems; optoelectronic, optical, MEMS and
MEOMS packaging applications; and systems level energy and thermal management.