Abstract: An array of conventional PCB surface finishes was tested in three different corrosive environments: conventional ISA/ASTM Class III mixed flowing gas
(MFG) test; high hydrogen sulfide MFG test; and Chavant clay test with condensing humidity.
The standard test for this has been the mixed flowing gas
Suitability for high reliability applications such as providing power to a tunable laser since this connector passes mixed flowing gas
(MFG) tests, ensuring continuous performance in the field.
Phase 3 of iNEMI's Creep Corrosion Project is currently performing laboratory-based experiments to further investigate the sensitivities of the influencing factors, including surface finish, flux, solder mask geometry, solder paste coverage, reflow and wave soldering, and mixed flowing gas
(MFG) test conditions (corrosive gas concentration, humidity, temperature).
The control modules are protected against seven key environmental conditions: humidity, salt mist, fungus resistance, temperature resistance, dust, mixed flowing gas
, and ISA.
Abstract: Test PCBs with various surface finishes were subjected to a mixed flowing gas
environment with gaseous composition adjusted to achieve a tarEleted 500-600nm/day copper corrosion rate.
The experiment was a combination of mixed flowing gas
to create creep corrosion and TOF-SIMS to identify the corrosion product.
Initial attempts to create a controlled test for creep corrosion will be conducted in mixed flowing gas