NEPESNew England Philosophy of Education Society
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Packaging specialists include Chipbond and TICP in Taiwan, UNISEM in Malaysia, and NEPES, LBS, SEMITEQ, Hanamicron, and Signetics in Korea, as well as AMKOR.
A good example would be to put together a leading analog IC player (such as TI, Maxim IC, NXP or ST) with a WLP/RDL partner (such as FCI, Casio Micronics, NEPES, etc) together with a PCB integrator player (such as Imbera / Daeduck, Ibiden, AT&S, Taiyo Yuden or SEMCO).
AMD, ATI, Amkor, Analog Devices, Apple, apm, ASE, Avago, AVX, Bourns, Bridgelux, CMD, Cree, CSR, Kyocera, Fairchild, Flip-Chip International, Fraunhofer Institutes, Freescale, Fujikura, Hymite, Ibiden IBM, IMEC, Infineon, ipdia, Ibiden, IME, IMEC, ITRI, Jazz Semiconductor, KST-World, Qualcomm, Leti, LG Innotek, Lumileds, Maxim IC, Micron, Murata / SyChip, National Semiconductor, Nichia, NEPES, Nokia, NXP, OnChip Devices, On Semiconductor, Paratek, RFMD, Shinko, Silex Microsystems, Skyworks, Semtech, STATSChipPAC, STMicroelectronics, SPIL, Telephus / SEMCO, Taiyo Yuden, Texas Instruments, Thales, Touch Microsystems Technology, Toshiba, Triquint, Tyndall, UMC, Vishay, Wavenics, Wispry, Zarlink and moreO