References in periodicals archive ?
capabilities are complementary with NFME's advanced packaging and test
elevate the competitiveness of NFME's flip chip packaging and test technologies
"With this joint venture, NFME's advanced packaging and
Also, as a part of AMD's ongoing strategic plan to sharpen its focus on designing high-performance technologies and products that drive profitable growth, the company announced the signing of a definitive agreement to create a joint venture with Nantong Fujitsu Microelectronics (NFME).
This JV will combine AMD's high-volume ATMP facilities and experienced workforce in Penang, Malaysia and Suzhou, China with NFME's established outsourced semiconductor assembly and test (OSAT) expertise to offer differentiated capabilities and scale to service a broad range of customers.