OIPMOffice of Intellectual Property Management
OIPMOffice of IT (Information Technology) Program Management (US FBI)
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Available in a compact 12 x 29mm SOP/DIP package, IR s oIPM -DIP product family offers a cost effective power solution by leveraging industry standard footprints and processes compatible with various PCB substrates.
By utilizing industry standard package footprints, IR s oIPM -DIP family is a significant expansion of the oIPM integrated power module family.
By utilizing an innovative packaging solution, IR's oIPM products not only offer up to 60 percent smaller footprint compared to existing leading solutions but also deliver advantages in output current capability and system efficiency.