RSAFPReliability, Stress Analysis and Failure Prevention (conference)
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* 21st Reliability, Stress Analysis, and Failure Prevention Conference (RSAFP)
Further information on the RSAFP Committee can be obtained from Erol Sancaktar, Department of Polymer Engineering, University of Akron, Akron, Ohio 44325-0301; e-mail:; phone: (330) 972-5508; fax: (330) 258-2339.
The topics considered by the Reliability, Stress Analysis and Failure Prevention (RSAFP) Committee are very diverse, as indicated by sampling subjects of conference sessions: Application of Fracture Mechanics to Design Reliability; Fatigue Failure and Crack Growth; Product Liability and Litigation; Risk Minimization; Improving Reliability Through Numerical Methods in Design; Design Procedures: Statistical Considerations; Aging of Structural Components; Smart Structures; Brittle Material Reliability; Designing Using Composite Materials; Electromagnetic Materials and Composites; Lifetime Prediction of Polymers and Composites; Adhesive Joining; Bolted Connections; Rubber Components and Springs.