S-CSPStacked Chip-Scale Package
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These packages were more than 20% of Amkor's total S-CSP production in the fourth quarter of 2003, which is the largest proportion in the outsourced chip packaging industry.
Amkor plans to keep its advanced S-CSP capacity ahead of industry demand.
Primary Systems has earned the promotion to S-CSP and I am delighted that they will also be our national reseller of telePROTECT.
Amkor's S-CSP combines thin-core substrates, silicon wafer thinning, and film die attach.
S-CSPs continue to derive increasing demand from cell phone handsets that combine voice and data functions.
Some industry watchers foresee 3G phones requiring four die S-CSPs.
Amkor's 3+ S-CSP packages have profile heights of 1.
Amkor offers the largest combined laminate based S-CSP and tape based CSP product portfolio in the outsourced market.
Amkor developed its S-CSP packaging technology, which combines two or more integrated circuits (ICs) in a stacked die configuration, to help original equipment manufacturers (OEMs) meet consumer demand for devices with more functions, that are thinner, more capable and reliable, and that are lighter weight.
The company expects S-CSP deliveries to grow in the second half of 2000 as new customers begin receiving shipments.
The expansion of the unified specifications group will help meet the growing demand for S-CSP products in the worldwide market for mobile communications and hand-held computing devices.