SDBGASuper Dissipation Ball Grid Array
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SDBGA has all the characteristics of near Chip Scale Packages (CSP) -- advanced packages which are lighter weight, smaller size and provide higher performance.
Handphones, for example, contain both flash and SRAM ICs and by stacking these on top of one another in an SDBGA package, the chip size is retained with enhanced capability.
With its two-in-one feature, the total SDBGA package height is typically 1.