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If the leaked thermal radiation is ignored, the STPV system energy flux through the intermediate module mainly contains four parts: incident sunlight by concentrator ([P.sub.s]), absorbed energy by absorber ([P.sub.a]), and thermal emission by absorber ([P.sub.at]) and emitter ([P.sub.e]), as shown in Fig.
Therefore, in a practical STPV system, the emitter area should be larger than the absorber area to sustain higher light concentrations and achieve superior intermediate efficiency.
Using the restored optical constants above, we re-optimized two new kinds of emitters (named as New Ta emitter and W emitter) to try to improve the high temperature performance of our STPV system, and the optimized absorption spectrums are also shown in Fig.
A deeper understanding of STPV technologies will allow the PV and window industry to provide the necessary materials and designs for high-performance windows.
In the case of a STPV window, a fraction of the energy absorbed is transformed to solar electricity while the rest is transformed to thermal energy:
Commercially available STPV windows can convert between 5% and 20% of the incident solar radiation into electricity, while the portion of solar energy that is converted into heat (roughly 30% to 70%, depending on the optical and thermal properties and PV technology used) contributes to the increase in temperature of the PV cells.
The compression set of the STPV, relative to the various CTPVs, is lower by approximately 20%, even at 125[degrees]C.
The long-term compression set of the STPV at 125[degrees]C has almost the same value as the initially measured compression set.
It was noticed that STPV had excellent long term elastic recovery properties, based on compression set, that increased by only 5%.
The most important distinguishing property for STPV is its excellent high temperature performance, and all 3000 materials have a CUT of 150[degrees]C (as defined by SAE J2236).
Due to the continuous thermoplastics phase, STPV products offer the flexibility of bonding to a variety of engineering thermoplastic substrates without adhesives.
To quantitatively evaluate the bonding strength of STPVs on various engineering thermoplastic substrates, a mold (figure 4) was designed to overmold TPSiV onto a pre-molded plastic substrate.
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