TCVS recognizes especially strong contributors to vibration and sound by administering the society-level J.
TCVS also sponsors ASME Journal of Vibration and Acoustics (JVA), which is a prestigious international journal in the area of vibration and acoustics.
In addition, TCVS members and friends organize reviewed paper sessions, lectures and panel sessions at the annual International Mechanical Engineering Congress and Exposition and other conference venues.
For 2013, TCVS and MSNDC co-sponsored the IDETC held August 4-7 in Portland, Oregon.
Members of TCVS meet twice a year: a spring meeting at Chicago and a fall meeting in IDETC.
In 2010, TCVS
sponsored a Special Conference on Vibration and Noise at the IDETC in Montreal, with TCVS
Secretary Dane Quinn as the Conference Chair where 49 papers were presented.