TEOLEDTop-Emitting Organic Light-Emitting Diodes
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Using material with high thermal conductivity coefficient as the TEOLED substrate could make TEOLED devices achieve better luminous characteristics.
Comparing (3) for the current TEOLED structure, the key factors affecting the heat flow rate are the thermal conductivity (k), substrate thickness (L), and UV glue materials.
The TEOLED structure is (glass; copper; graphite) substrate/YCD91 glue/Al/Au/EHI608/TAPC/[Alq.sub.3]/LiF/Al/Ag.