Also found in: Wikipedia.
TSSOPThin Shrink Small Outline Package
TSSOPThin Scale Small Outline Package
Copyright 1988-2018 AcronymFinder.com, All rights reserved.
References in periodicals archive ?
With hundreds of programmable and standard configurations available in several QFN and TSSOP package options, the lead-free solutions operate at -40C to +85C and are targeted for use in switches/routers, high-end storage and server platforms for enterprise and data center usage, SONET/SDH transport and access equipment, xPON equipment, video servers and cellular base stations.
The devices are housed in 8-pin, Pb-free and Green SOIC and TSSOP packaging.
Both switches are available in a low profile 16-pin QFN (RGY) package along with the SSOP (DBQ), and TSSOP (PW) packaging.
With an input frequency range of 0.1 to 2.5 GHz and a dynamic range of 45 dB, the RTG9001 adds 3 bits of threshold programmability in a 14-pin TSSOP. Once RF power exceeds the threshold, four digital outputs sequentially go true with 0, 5, 10 and 35 ms delay, respectively.
Offered in two ultra-small packages, including a 6.4mm x 6.5mmVO20 TSSOP and a 8mm x 9mm FS48 thin flat ball grid array, the Xilinx Platform Flash PROM family also provides the smallest footprint in the industry.
They performed the reliability prediction of a solder joint of plastic ball grid array (PBGA) package and thin-shrink small outline package (TSSOP) under launch random vibration using Sherlock.
* Various package options, including DIP, TSSOP, QFN, and DSBGA, for design flexibility.
The first microcontrollers in the programme are from NXP's Cortex-M0 family: LPC1100XL, NXP's lowest-current MCU with 110uA/MHz; LPC1100L in low-pin-count SO, TSSOP and DIP packages; LPC11U00, the first USB Cortex-M0 with integrated ROM drivers; LPC11C00 with on-chip CAN transceiver; and LPC11E00 with integrated 4 KB EEPROM.
The MCP795WXX RTCC devices are available today in 14-pin SOIC and TSSOP packages.
Aries Electronics offers a line of adapters which convert TSSOP, QFP and other fine pitch devices to any other fine-pitch bumped package or routing configuration down to 0.4mm pitch.