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TSVTrinity Square Video (Canada)
TSVThrough-Silicon Vias (chip packaging; used to design smaller camera modules)
TSVTransport Safety Victoria (Australia)
TSVTaos Ski Valley (Taos Ski Valley, MN)
TSVTab Separated Value
TSVTieteellisten Seurain Valtuuskunta (Finnish: Federation of Finnish Learned Societies)
TSVToday's Special Value (QVC advertisement)
TSVTaura Syndrome Virus
TSVTobacco Streak Virus
TSVTheater Support Vessel
TSVTime Segmented Volume (finance)
TSVToyota Services de Venezuela (vehicles)
TSVTurnsportverein (German: gymnastics and sports club; aka Turn- und Sportverein)
TSVTownsville, Queensland, Australia - Townsville (Airport Code)
TSVTime Spent Viewing
TSVTemps Solaire Vrai (French: True Solar Time)
TSVTrajectory Shaping Vehicle
TSVTab Separated Values/Variables
TSVTest Status Verification (Hekimian)
TSVTactical Secure Voice
TSVTerminal Sire Value
TSVTest Suite Variables (TTCN)
TSVTidal Stream Vector (marine navigation)
TSVTechnicien des Services Vétérinaires (French: Veterinary Services Technician)
TSVTransport and Services (Internet Engineering Task Force)
TSVTheater Structure Variables
TSVTolerance Stackup Validation (engineering)
TSVToxicity Screening Value
TSVTurbine Shutoff Valve (energy generation)
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References in periodicals archive ?
The length of the TSV is 80 [micro]m < l < 100 [micro]m.
Despite their name, TSV 1860 Munich were originally formed in 1848 as a gymnastics club, but a year later the club was banned by the Bavarian monarchy in 1849 due to it being an "institute of moral contamination", according to the club website.
It's found that the excitation source primarily generates a single mode in the TSV; the lowest order longitudinal mode.
Wide I/O typically uses TSVs, interposers and 3D stacking technologies.
These technologies provide the high productivity and process control needed to integrate TSVs into production environments.
The complex characteristic impedance of SE TSV with consideration of the dissipative loss and the oxide capacitance effect can be expressed in terms of the equivalent-circuit parameters as
Cost-effective temporary bonding solutions are a key enabler for this advanced technology by bonding today's ultra-thin active device wafers to thicker carrier wafers for subsequent thinning and TSV formation.
Abstract: A scalable 3D-FPGA using TSV interconnects is proposed.
Kostov cited a publication of the Pik agency of a leaked tape of a conversation between two persons called "Ogi and Svetlana" who mention people with initials B.B., Tsv. Tsv.
The modest but welcoming ground is the home of TSV Landsberg, who attract crowds of 400 on a good day in the German sixth tier.
IBM said that its TSV chip-making process enables Micron's Hybrid Memory Cube (HMC) to achieve speeds 15 times faster than today's technology.
Contributors from companies mostly in California and Arizona explain in detail wafer-to-water, three-dimensional (3D) integrated circuit (IC) stacking technology using through-silicon-via (TSV) techniques.