The ultra-thin-chip package (UTCP) technology offers the possibility to integrate functional devices inside flexible multilayer circuit boards.
Recently, an ultra-thin-chip package (UTCP) technology was worked out, which allows embedding thin dies inside these flexible circuits.
Recently, Belgian researchers from IMEC and the Ghent University developed an alternative approach for integrating ICs in PCBs and FPCBs: the ultra-thin-chip package (UTCP) technology, which permits testing of the chip before embedding and provides a contact fan out with a more relaxed pitch.
UTCP technology is a polyimide-based embedding technology for integrating very thin silicon chips in flexible substrates.
Based on the above-mentioned UTCP approach, a technology was worked out for the 3D integration of active devices inside the innerlayers of commercial multilayer flexible circuit boards (FIGURE 2).
Traditional TCP congestion control algorithms are found to perform poorly over wireless networks: [check] Traditional TCP: Packet loss = Congestion [check] Wireless networks: Packet loss [not equal to] Congestion The performance of UTCP
on a Wireless network with the following attributes: 5Mbps available bandwidth, 1% packet loss, 100ms round trip time.