VBGAVanDusen Botanical Garden Association (Vancouver, Canada)
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The VBGA package is designed using a ceramic interconnect substrate with solid tungsten-copper vias.[1,2] The ceramic is 99.6 percent alumina.
The flexibility of VBGA thin-film technology allows the incorporation of any chosen transition to the MMIC RF ports.
A ceramic substrate, shown in Figure 9, was designed to mount the VBGA package, including co-planar transitions from the 0.010[inches] (0.254 mm) pitch of the probes to the 0.038[inches] (0.965 mm) pitch of the package's RF port balls.