VBGAVanDusen Botanical Garden Association (Vancouver, Canada)
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The VBGA package is designed using a ceramic interconnect substrate with solid tungsten-copper vias.
The flexibility of VBGA thin-film technology allows the incorporation of any chosen transition to the MMIC RF ports.
A ceramic substrate, shown in Figure 9, was designed to mount the VBGA package, including co-planar transitions from the 0.
Until the advent of ProLinx's VBGA substrates, plastic packages have provided the most attractive package solution from a price/performance standpoint.
ProLinx offers PC-based design tools in order to facilitate VBGA package design.