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Low Abstract: Thin-film cracking was observed on the top die of a 2COB vfBGA package, post MST soak and 3X reflow.
TYPE SIZE QUANTITY RF PHS Transceiver QFN40 (6 mm X 6 mm) 1 PAS Baseband Processor 240 BGA (12 mm X 12 mm) 1 16 Mb Boot Flash 48 VFBGA (10mm X 13 mm) 1 Crystal Oscillators 6 OSC (2.5 mm X 2 mm) 1 (TCXO) 300 mA LDO Regulator 8 MSOP (3mm X 5 mm) 1 150 mA LDO Regulator 6 SOT-2313 mm X 3 mm) 1 SPOT switch 6 SOT-363 (2 mm X 2.1 mm) 1 PHS Power amplifier 12 FQFP (3 mm X 3 mm) 1 Silicon serial number 3 SOT-3 (3mm X 3 mm) 1 Capacitors 201 77 Capacitors 402 8 Capacitors 603 13 Inductors 201 8 Inductors 402 4 Resistors 201 48 Shields Card-sized 2
Size: 96-pin 6 X 6 mm VFBGA package and bumped die option.
This was confirmed in a recent paper by Hua, et al (4), in which VFBGA * and SCSP ** packages assembled using a ramp profile with a low peak reflow temperature (208[degrees]C) and a short time above SnPb liquidus (30-60 sec.) resulted in unacceptable solder joints.
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