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References in periodicals archive ?
Addressing silicon wafer defect detection, Sonoscan has developed the Quantitative Dynamic-Z surface tracking feature (Figure 1) for scanning warped wafers.
Z Wang [14] introduced hardware and software architecture of quartz wafer defect inspection system consisting of three modules, including image acquisition, image processing and defect detection.
August Technology Corporation (Nasdaq:AUGT), Bloomington, Minn., has received an order from a leading bumping facility in Taiwan for its new 3Di-8000, a complete system integrating 100% 2D and 3D bump and wafer defect inspection.
Designed for characterization and monitoring of the diverse processes used in wafer-level packaging, CIRCL-AP enables all-surface wafer defect inspection, review, and metrology at high throughput.
For example, working with a major semiconductor manufacturer in the United States, Tamar has developed and deployed a wafer defect detection system for inspecting macro defects of 5 [micro]m on ultrathin patterned wafers for post-fab use (Figure 1).
During chip development, this suite of detection technologies helps find the wafer defects that most immediately threaten yield, accelerating the identification of design issues that reveal the need for mask design.
The system is designed to uncover wafer defects such as dislocations, precipitates and process-induced defects.