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WLPWebLogic Portal (Bea Systems)
WLPWomen's Learning Partnership (Bethesda, MD)
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WLPWhite Lined Pulp (plastic bottles, child resistant snap caps)
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References in periodicals archive ?
As a global leader geared towards meeting the industry's ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in- package, final test and electronic manufacturing services through USI Inc and its subsidiaries, members of the ASE Group.
Under this order, Rudolph Inspection, Metrology and Analysis have been selected for large-scale ramp of Fan-out Wafer Level Package Production (FOWLP).
Folded slot antenna has many advantages to the wafer level package. The most important one is its wide bandwidth [9].
He said in addition to copper wire bonding, the company would provide other cutting-edge packaging technologies such as aQFN (advanced quad flat no lead) package and Fan-Out wafer level package.
"Solder Joint Reliability of a Polymer Reinforced Wafer Level Package," Proceedings of the 52nd Electronic Components and Technology Conference, San Diego, CA, May 2002.
Presentations covered a wide range of package options, including the latest trends in stacked die for flash memory applications, an update from Samsung on its 3D TSV stacked memory supplied on DIMMs for high-performance applications, and SPIL with details of many new package offerings, including a fingerprint sensor, multiple flip-chip interconnect, a fan-out wafer level package (FO-WLP), high bandwidth package-on-package (PoP), assembly for silicon interposers, and a packaging alternative to silicon interposers.
Several companies and research organizations have reported progress on developing large area process or panel fan-out wafer level packages (FO-WLPs), says TechSearch.
New dummy components include leading edge packages like eWLP Embedded Wafer Level Packages, WLP Wafer Chip Size Packages, and TMV[R] PoP Through Mold Via Packages.
For the second year in a row, the most heavily attended sessions focused on fan-out wafer level packages (FO-WLP).
This paper presents a number of interesting and useful findings during the process of fabricating fine-pitch copper pillar bumps on 300mm wafers for use in advanced, fine pitch and high I/O wafer level packages. The copper pillar bump construction is based on the IBM metal post solder chip connection (MPS-C2) design, with a slim post and a Pb-free solder cap (Sn of SnAg) on top.