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References in periodicals archive ?
The structures are then subjected to wafer level packaging scheme using SU8-10 packaging technique.
SPIL is the world's third largest IC assembly and testing house, with wire bonding, flip-chip, wafer level packaging, bumping, multichip package and high-level assembly and testing technology.
This product is also the first single-chip CMOS-MEMS integrated barometer adopted Wafer Level Packaging for consumer electronics on the global market.
A special keynote by TSMC introduced its new fan-out wafer level packaging technology, Integrated Fan-Out (InFO), targeted at the mobile application space.
TIPS technology offers a number of important advantages as compared to earlier die-stacking approaches such as bare-die package-onpackage (PoP), molded laser via PoP, molded laser via exposed die PoP, embedded die in laminate, Fan-Out Wafer Level Packaging (FO WLP!
The company has also developed a new through-hole technology on thin glass substrates for the wafer level packaging of MEMS devices.
Off to a slow start, the industry ended with capacity fully utilized for a multitude of packaging and assembly operations including gold bumping, wafer level packaging, laminate substrates and component assembly of all types.
The acquisition of FCI, which is engaged in Flip Chip bumping and wafer level packaging, adds a range of advanced wafer level packaging technologies to the TSHT strong product portfolio.
"We are interested in their focus for backend semiconductor assembly that we don't currently have: advanced packaging, fan-out wafer level packaging, CSP--that overall SMT architecture that is close in accuracy to backend IC packaging," Joe Elgindy, K&S director of investor relations and strategic planning, told Circuits Assembly.
Processing at the wafer level now includes redistribution and solder bumping, gold bumping, wafer level packaging and post-passivation layer processing such as the addition of thick copper.