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EWLB chairman Peter Ellwood, who is group chief executive of Lloyds TSB, says: "By putting work-life policies at the heart of corporate culture we've been able to improve morale and reduce absenteeism and employee turnover."
While a long list of companies has developed fan-out packages, Infineon's eWLB technology has been adopted by ASE and STATS ChipPAC and is in high-volume production.
Freescale Semiconductor's RCP and Infineon's eWLB are examples of this technology.
ASE compared electrical performance of eWLB, M-Series, and a chip-last approach.
STATS ChipPAC, STMicroelectronics, and Intel reported on research in combining eWLB fan-out WLP technology with TSV and integrated passive device technology to achieve new levels of heterogeneous integration.
Stats ChipPAC discussed reliability of eWLB for automotive radar applications.
STATS ChipPAC announced cumulative shipments of 1 billion FO-WLPs in the form of the eWLB (the FO-WLP licensed from Infineon) and presented the latest on its 3D stacked eWLB, and work in conjunction with Rudolph Technologies on large-area panel processing.
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