iNEMI

Acronym	Definition
iNEMI	International Electronics Manufacturing Initiative

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The IPC Roadmap on fabrication was far more valuable for the engineers than iNEMI's, which was written at a higher level.

A BROKEN PATH

In phase 1 of the project, iNEMI conducted a survey on BIST availability, usage, and access at board-level test.

Embedded test complements boundary scan

RELATED ARTICLE: INEMI IDENTIFIES TOP ELECTRONICS RESEARCH PRIORITIES

Keeping connected: connector technology still grapples with smaller platforms, higher speeds and placement issues

The timing of which applications will convert to optical technology remains unclear, but is not expected to happen within the 10-year period covered by the 2007 iNEMI Roadmap.

Optoelectronic substrates--will it happen? The economic model for the optoelectronic interconnect favors high data rate transmission over moderate to long distances, limiting applications to high-end telecommunication systems

IPC's oversight eventually gave way to iNEMI, and the latter really stepped up its game.

A Fork in the Roadmap

IN THE JULY issue of CIRCUITS ASSEMBLY, in presenting the direction taken by the 2009 iNEMI Roadmap chapter on Photovoltaics, Alain Harrus and Jim Handy underscore that the principal barrier to widespread adoption of PV technology is its cost compared to the energy it generates.

Methods for printing cell conductors: the two primary ways need more repeatable accuracy

The 2007 iNEMI Roadmap discusses issues relating to modeling and simulation and the challenges posed by current and future products.

Critical requirements for next generation modeling and simulation tools: the pressure to reduce design cycle time and minimize testing and validation necessitates improved mechanical and reliability modeling and electrical and thermal simulation tools

"A Cost-Effective & Convenient Approach to Creep Corrosion Testing" details how an iNEMI task group created a qualification test to determine whether PCBAs are likely to develop creep corrosion.

iNEMI Publishes White Paper on Creep Corrosion Testing

To register, visit inemi.org/events/2013 -inemi-roadmap-rollout-webinar-europe-north-america--MB

2013 iNEMI Roadmap webinar this month

Michael Gaitan of NIST, who chairs the iNEMI and ITRS MEMS technology working groups, is pursuing a roadmapping strategy, as I recount on page 36.

Driving MEMS commercialization

The 2009 iNEMI Roadmap (3) identifies several PWB fabrication needs, including:

Information management gaps for board fabrication and assembly: progress toward complete data packages has been slow

HERNDON, VA -- The International Electronics Manufacturing Initiative (iNEMI) reported that a majority of its OEM and EMS members strongly support unique part numbers for BGA components to differentiate any lead-flee ball metallurgies other than SAC 305 or SAC 405, including low silver, added dopants such as nickel, and other SAC (or non-SAC) alloy compositions.

iNEMI members call for unique part numbers for ball metallurgies on lead-free components