iNEMI

AcronymDefinition
iNEMIInternational Electronics Manufacturing Initiative
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iNEMI membership is not required to participate in the roadmap.
The Diversity of HIGH-END SYSTEMS: Technology and market drivers for computing, networking and storage
The timing of which applications will convert to optical technology remains unclear, but is not expected to happen within the 10-year period covered by the 2007 iNEMI Roadmap.
Optoelectronic substrates--will it happen? The economic model for the optoelectronic interconnect favors high data rate transmission over moderate to long distances, limiting applications to high-end telecommunication systems
In phase 1 of the project, iNEMI conducted a survey on BIST availability, usage, and access at board-level test.
Embedded test complements boundary scan
RELATED ARTICLE: INEMI IDENTIFIES TOP ELECTRONICS RESEARCH PRIORITIES
Keeping connected: connector technology still grapples with smaller platforms, higher speeds and placement issues
Concerns about these changes in metallurgies prompted iNEMI to release the following statement:
iNEMI members call for unique part numbers for ball metallurgies on lead-free components
The 2007 iNEMI Roadmap discusses issues relating to modeling and simulation and the challenges posed by current and future products.
Critical requirements for next generation modeling and simulation tools: the pressure to reduce design cycle time and minimize testing and validation necessitates improved mechanical and reliability modeling and electrical and thermal simulation tools
Indeed, iNEMI, the consortium driving the key industry research in the mid 1990s, had settled on SAC 396.
Elemental questions
If they see something that borders on what iNEMI is doing, they let us know, and we talk to iNEMI to be sure there is no overlap.
Quietly, HDPUG gaining members, performing research
Gaitan, who chairs the iNEMI and ITRS MEMS technology working groups, said his intention was not to talk about solutions but rather problems.
Vendors drive IC advancements
The 2009 iNEMI Roadmap (3) identifies several PWB fabrication needs, including:
Information management gaps for board fabrication and assembly: progress toward complete data packages has been slow
iNEMI 1994; Electronics (International incorpo- manufacturing.
Can R&D consortia increase the PCB industry's innovation output? Collaborative research provides an economical avenue that fosters process innovation and new product development channels
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