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References in periodicals archive ?
An Intel spokesman said the move to EUV and 450-mm wafers will help reduce chip production costs by up to 40 percent.
Last year, Taiwan had an equivalent 2.8 million 200mm wafers of fabrication capacity a month, vs.
One can then use the above wafer structures as the base and add to them one/some/all of the below technologies to further enhance cell performance.
The company exported around 54.8 megawatts of Virtus wafers and 20 MW of Virtus modules, which are manufactured using Virtus wafers, to a number of the Company's top customers in Europe.
Research and development of the so-called wide wafer is taking place at the company's Marlboro headquarters.
Grinding marks (figure 3), or grinding linear are the traces left by the grinding wheel on the wafer surface A (figure 3) and the "cress-cross" on the wafer surface B (Sun et al., 2004).
The deal is structured as a take-or-pay contract and wafers will be delivered based on the prevailing market prices.
"To support our production expansion efforts, we selected EV Group's wafer bonding and UV-NIL systems not only for their high-volume capabilities, but also for their support of our preferred wafer-level technology process.
NSP's Chairman Quincy Lin said, "Including such a creative wafer maker into our diversified wafer base shall further enhance our capacity on volume delivery of the newly launched 'Perfect Cell'.
Signs Wafer Supply Contracts(C)2008 JeraOne -
Semiconductor wafer bonding 9; science, technology, and applications; proceedings.
Shin-Etsu Chemical Co., the world's largest silicon wafer maker, said Wednesday it will spend 120 billion yen to substantially expand its group's 300-millimeter wafer production capacity to meet growing demand.